BGF128 hdmi interface esd protection data sheet, v2.1, april 2009 rf & protection devices
edition 2009-04-01 published by infineon technologies ag 81726 mnchen, germany ? infineon technologies ag 2009. all rights reserved. legal disclaimer the information given in this docu ment shall in no event be regarded as a guarantee of conditions or characteristics (?beschaffenheitsgarantie?). with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the app lication of the device, infi neon technologies hereby disclaims any and all warranties a nd liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. information for further information on technology , delivery terms and conditions and prices please contact your nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements components may contain da ngerous substances. for information on the types in question please contact your nearest infineon technologies office. infineon technologies components may only be used in life-support devices or systems with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safe ty or effectiveness of that device or system. life support devices or systems are intended to be implanted in the hu man body, or to support an d/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
BGF128 hdmi interface esd protection data sheet 3 v2.1, 2009-04-01 BGF128 revision history: 2009-04-01, v2.1 previous version: 2009-03-02, v2.0 page subjects (major cha nges since last revision) 4 marking updated 6 figure 3 added
data sheet 4 v2.1, 2009-04-01 BGF128 hdmi interface esd protection BGF128 BGF128 description BGF128 is an esd protection circuit for control data lines of an hdmi interface. all external ios are protected against esd pulses of 15 kv contact discharge according to iec61000-4-2. the wafer level package is a green lead-free and halogen-free package with a size of only 1.15 mm x 1.15 mm and a total height of 0.6 mm. figure 1 schematic features ? esd protection circuit for control data lines of an hdmi interface ? esd protection according to iec61000-4-2 for 15 kv contact discharge on external ios ? wafer level package with snagcu solder balls ?400 m solder ball pitch ? rohs and weee co mpliant package type package marking chip BGF128 wlp-8-9 28 n0747 table 1 maximum ratings parameter symbol values unit note / test condition min. typ. max. voltage at all pins to gnd v p 0?5v? operating temperature range t op -40 ? +85 c? storage temperature range t stg -65 ? +150 c? summed up input power for all pins p in ??60mw t s <70c electrostatic discharge according to iec61000-4-2 contact discharge at internal pin c1 to any other pin v esd -2 ? 2 kv ? contact discharge at external pins a1, a2, a3, b3, c3 to gnd v esd -15 ? 15 kv ? wlp-8-9-n-3d bgf 128 _schematic . vsd c1 c3 b3 a3 r1, 1750 ? r2, 1750 ? r3, 100 k ? a2 a1 b2 (gnd) c2 (gnd)
BGF128 hdmi interface esd protection BGF128 data sheet 5 v2.1, 2009-04-01 package outlines figure 2 package wlp-8-9 table 2 electrical characteristics 1) 1) at t a =25 c parameter symbol values unit note / test condition min. typ. max. resistors r 1 , r 2 r 1,2 1575 1750 1925 ? ? resistor r 3 r 3 80 100 120 k ? ? leakage current of esd protection diodes i r ? ? 1 2 100 200 na na v =3v v =5v breakdown voltage of esd diodes 2) 2) after snap-back v (br) ?18.5 -12.5 ?v i (br) = 1ma i (br) =-1ma line capacitance a1, a2, a3, b3, c3 3) 3) capacitance measured from designated pi n to gnd. pin c1 connected to gnd. c t 8 1012pf v =0v corner index area pin 1 2) coplanarity 0.6 seating plane 0.08 8x c c standoff 3) 0.05 0.2 0.05) (0.175 0.05) (0.175 0.05 0.1 c 0.4 0.05 1.15 b 2 x 0.4 = 0.8 0.4 1.15 0.05 a a 8x ?0.05 m 0.25 b 0.04 1) 3) primary datum c and seating plane are defined by the domed crowns of the balls 1) dimension is measured at the maximum solder ball diameter, parallel to primary datum c 2) a1 corner identified by marking wlp-8-9-n-po v01 2 x 0.4 = 0.8 c1 c2 c3 b2 b3 a2 a1 a3 0.05) (0.175 0.05) (0.175 solder balls face down solder balls face up
data sheet 6 v2.1, 2009-04-01 BGF128 hdmi interface esd protection BGF128 footprint figure 3 recommended pcb pad design for reflow soldering tape figure 4 tape for wlp-8-9 you can find all of our packages, sorts of packing and others in our infineon internet page ?products?: http://www.infineon.com/products . 0.4 0.8 0.4 0.8 0.25 wlp-8-9-n-fp v01 wlp-8-9-n-tp v01 pin 1 corner index area 8 1.33 1.33 0.25 0.75 4
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